Institute of Electrical and Electronics Engineers Inc.;New York, NY: IEEE
摘要:
摘要： In this paper, a fully system-in-package (SiP) integrated V -band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips. 其他題名： TMTT 出版者： New York, NY: IEEE 出版日期： 2012-05-01 出處： IEEE transactions on microwave theory and techniques, 2012-05, Vol.60 (5), p.1424-1436 資源來源： IEEE Electronic Library (IEL) 版權： 2015 INIST-CNRS 識別號： ISSN: 0018-9480 識別號： EISSN: 1557-9670 識別號： DOI: 10.1109/TMTT.2012.2187795 識別號： CODEN: IETMAB
