Barrier property of a Ta/MnSixOy Layer formed by a ta-mn alloy for a cu interconnect

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Title:	Barrier property of a Ta/MnSixOy Layer formed by a ta-mn alloy for a cu interconnect
Authors:	辛正倫;Hsin, Cheng-Lun;Lin, Kun-Yen
Contributors:	資訊電機學院電機工程學系
Date:	2016-08-01
Issue Date:	2026-04-23 13:35:49 (UTC+8)
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Abstract:	出版日期： 2016-08 出處： IEEE electron device letters, 2016-08, Vol.37 (8), p.1048-1050 資源來源： IEEE Electronic Library (IEL) Journals 識別號： ISSN: 0741-3106 識別號： EISSN: 1558-0563 識別號： DOI: 10.1109/LED.2016.2582499
Appears in Collections:	[Department of Electrical Engineering] journal & Dissertation

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