Chip-level 1 2 optical interconnects using polymer vertical splitter on silicon substrate

NCUIR > College of Electrical Engineering & Computer Science > Department of Electrical Engineering > journal & Dissertation > Item 987654321/106745

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Title:	Chip-level 1 2 optical interconnects using polymer vertical splitter on silicon substrate
Authors:	林祐生;Chen, Chin-Ta;Shen, Po-Kuan;Zhu, Teng-Zhang;Chang, Chia-Chi;Lin, Shu-Shuan;Zeng, Mao-Yuan;Chiu, Chien-Yu;Hsiao, Hsu-Liang;Lan, Hsiao-Chin;Lee, Yun-Chih;Lin, Yo-Shen;Wu, Mount-Learn
Contributors:	資訊電機學院電機工程學系
Keywords:	micromirrors;optical interconnection;Optical interconnections;Optical polymers;Optical reflection;Optical waveguides;Silicon;silicon substrate;Vertical cavity surface emitting lasers
Date:	2014-04-01
Issue Date:	2026-04-23 13:39:16 (UTC+8)
Publisher:	Institute of Electrical and Electronics Engineers Inc.;IEEE
Abstract:	摘要： The chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ° reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of -3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10 -12 for two output ports is achieved. It reveals that such chip-level 1 × 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports. 其他題名： JPHOT 出版者： IEEE 出版日期： 2014-04 出處： IEEE photonics journal, 2014-04, Vol.6 (2), p.1-10 資源來源： IEEE Electronic Library (IEL) 識別號： ISSN: 1943-0655 識別號： ISSN: 1943-0647 識別號： EISSN: 1943-0647 識別號： DOI: 10.1109/JPHOT.2014.2306843 識別號： CODEN: PJHOC3
Appears in Collections:	[Department of Electrical Engineering] journal & Dissertation

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