Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects

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Title:	Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects
Authors:	林祐生;Chen, Chin-Ta;Hsiao, Hsu-Liang;Shen, Po-Kuan;Lu, Guan-Fu;Lan, Hsiao-Chin;Lee, Yun-Chih;Chang, Chia-Chi;Li, Jen-Yu;Nedle, Ajay;Chang, Shuo-Fu;Lin, Yo-Shen;Wu, Mount-Learn
Contributors:	資訊電機學院電機工程學系
Date:	2012-11-01
Issue Date:	2026-04-23 14:25:30 (UTC+8)
Publisher:	SPIE;Society of Photo-Optical Instrumentation Engineers
Abstract:	摘要： The development of a 4-channel×10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical sub-assembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is −5.2 and −2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10−12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel×10-Gbits/s optical interconnects. 其他題名： Opt. Eng 出版者： Society of Photo-Optical Instrumentation Engineers 出版日期： 2012-11-01 出處： Optical engineering, 2012-11, Vol.51 (11), p.115005-115005 版權： 2012 Society of Photo-Optical Instrumentation Engineers (SPIE) 識別號： ISSN: 0091-3286 識別號： EISSN: 1560-2303 識別號： DOI: 10.1117/1.OE.51.11.115005
Appears in Collections:	[Department of Electrical Engineering] journal & Dissertation

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