Packaged triplexer based on distributed coupling technique

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題名:	Packaged triplexer based on distributed coupling technique
作者:	凃文化;Wu, Jyun-Yi;Tseng, Yu-Hsiang;Tu, Wen-Hua
貢獻者:	資訊電機學院電機工程學系
關鍵詞:	Circuit boards;Competition;Filtering theory;Insertion loss;Microwave theory and techniques;Microwaves;Noise levels;Packages;Passband;Ports;Printed circuit boards;Printed circuits;Resonant frequency;Scattering parameters
日期:	2012-01-01
上傳時間:	2026-04-23 14:29:00 (UTC+8)
出版者:	Institute of Electrical and Electronics Engineers Inc.;New York: IEEE
摘要:	摘要： By analyzing various output port layouts and transmission zeros resulting from high-order resonators, the appropriate order of the packaged circuit can be determined. The optimal packaged triplexer can reduce losses and improve isolation. Compared with tapped-line structures or coupled feeding lines, design processes can be simplified by employing distributed coupling techniques in the input and output ports. With the distributed coupling techniques used, all one needs to do is modify the mismatch between every single channel and the metal package. Matching conditions of different frequency bands are no longer designed individually at the CP. Hence, the whole design procedure can be simplified dramatically. In this way, high independence and tiny impact between the adjacent channels shorten the time spent on fine tuning and debug so that these two pieces of hard ware can meet specifications and requirements in a limited time. 其他題名： MMM 出版者： New York: IEEE 出版日期： 2012-01 出處： IEEE microwave magazine, 2012-01, Vol.13 (1), p.139-145 資源來源： IEEE Electronic Library (IEL) 版權： Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jan/Feb 2012 識別號： ISSN: 1527-3342 識別號： EISSN: 1557-9581 識別號： DOI: 10.1109/MMM.2011.2174122 識別號： CODEN: IEMMFF
顯示於類別:	[電機工程學系] 期刊論文

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