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    請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/108038


    題名: Pretest Gap mura on TFT LCDs using the optical interference pattern sensing method and neural network classification
    作者: 蔡章仁;Li, Tung-Yen;Tsai, Jang-Zern;Chang, Rong-Seng;Ho, Li-Wei;Yang, Ching-Fu
    貢獻者: 資訊電機學院電機工程學系
    關鍵詞: Classification;Crystal defects;Defects;Image process;Image processing;Inspection;Inspections;Interference;Interference fringes;mura;neural network;Neural networks;Quality control;Sealing materials;Semiconductor devices;Studies;Thin film transistors;thin-film transistor (TFT) liquid crystal (LC) display (LCD) (TFT LCD)
    日期: 2013-01-01
    上傳時間: 2026-04-23 14:33:06 (UTC+8)
    出版者: IEEE Industrial Electronics Society;New York: IEEE
    摘要: 摘要: Recently, thin-film transistor liquid crystal displays (TFT LCDs) have had a high demand in the market, which entails careful product quality control and more stringent defect detection procedures. A good defect detection rate is the basic requirement of the quality control process. The use of conventional human visual inspection methods to find the defects in TFT LCDs is simply not accurate enough and consumes a large amount of resources. An automatic defect inspection method is thus necessary for this industry; to find the defects, the type of defects needs to be recognized as well. Here, we propose an inspection procedure based on the optical interference pattern sensing method to find the interference fringes and then use the image processing to enhance the contrast of the interference fringes, thereby increasing the recognition rate for the latter process. The neural network method is used to learn about and identify the defects and their types. This paper focuses on the mura defect inspection and classification method. Before the learning process has begun, the mean squared error was roughly three, but after neural network retraining of these samples, the results showed that the mean squared error was less than 0.01. The defective panels can be sorted out using this method so that the next processing and waste of materials can be avoided.
    其他題名: TIE
    出版者: New York: IEEE
    出版日期: 2013-09-01
    出處: IEEE transactions on industrial electronics (1982), 2013-09, Vol.60 (9), p.3976-3982
    資源來源: IEEE Electronic Library (IEL)
    版權: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Sep 2013
    識別號: ISSN: 0278-0046
    識別號: EISSN: 1557-9948
    識別號: DOI: 10.1109/TIE.2012.2207658
    識別號: CODEN: ITIED6
    顯示於類別:[電機工程學系] 期刊論文

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