Determination of wafer center position during the transfer process by using the beam-breaking method

NCUIR > Engineering College > Departmant of Mechanical Engineering > journal & Dissertation > Item 987654321/108609

Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/108609

Title:	Determination of wafer center position during the transfer process by using the beam-breaking method
Authors:	陳怡呈;Chen, Yi-Cheng;Wang, Zhi-Gen;Huang, Bo-Kai
Contributors:	工學院機械工程學系
Keywords:	Acceleration;Blades;Judgments;Mathematical analysis;Real time;Robots;Sensors;Wafers
Date:	2014-09-01
Issue Date:	2026-04-23 14:58:56 (UTC+8)
Publisher:	IOP Publishing Ltd.;IOP Publishing
Abstract:	摘要： A wafer on a robot blade may slip due to inertia sliding during the acceleration or deceleration process. This study presents the implementation and experimental verification of a novel real-time wafer positioning system to be used during the transfer process. A system-integration computer program involving a human-machine interface (HMI) was also developed, exhibiting the following functions: (a) moving direction judgment; (b) notch-passing judgment; (c) indicating the sensor by which the notch passes; and (d) computing the wafer center in real time. The position of the wafer center is calculated based on the time-sequence of the beam-breaking signals from two optical sensors, and the geometric relations among the sensing points of the robot blade and wafer. When using eight-inch wafers, the experimental results indicated the capabilities of the proposed positioning system under various conditions, including distinct parameters regarding the moving direction, wafer displacement and notch-passing sensors. The accuracy and precision (repeatability) of the measurement in various conditions were calculated and discussed. Furthermore, the experimental results demonstrate that, after combining the novel wafer positioning system and HMI program, the proposed method can be used to compute the position of the wafer center in real time in various conditions. 其他題名： MST 其他題名： Meas. Sci. Technol 出版者： IOP Publishing 出版日期： 2014-09-01 出處： Measurement science & technology, 2014-09, Vol.25 (9), p.94006-10 資源來源： Institute of Physics Journals 版權： 2014 IOP Publishing Ltd 識別號： ISSN: 0957-0233 識別號： EISSN: 1361-6501 識別號： DOI: 10.1088/0957-0233/25/9/094006 識別號： CODEN: MSTCEP
Appears in Collections:	[Departmant of Mechanical Engineering ] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	22	View/Open

社群 sharing

Loading...