摘要： ► A LED package structure of W5II based on the COB technology for high power LEDs. ► W5II structure with vertical design assembles LEDs to sockets of fixtures easily. ► W5II showed low junction-to-board thermal resistance (Rθjb) of 3.714°C/W. ► Good heat dissipation of W5II provides good lumen maintenance of high power LEDs. A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages. 出版者： Elsevier Ltd 出版日期： 2012-05 出處： Microelectronics and reliability, 2012-05, Vol.52 (5), p.878-883 資源來源： ScienceDirect - Freedom Collection 版權： 2011 Elsevier Ltd 識別號： ISSN: 0026-2714 識別號： DOI: 10.1016/j.microrel.2011.07.064
