Inkjet printing of a pH sensitive palladium catalyst patterns of ITO glass for electroless copper

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Title:	Inkjet printing of a pH sensitive palladium catalyst patterns of ITO glass for electroless copper
Authors:	洪榮洲;Wang, Min-Wen;Liu, Tsai-Yun;Pang, Da-Chen;Hung, Jung-Chou;Tseng, Chun-Chieh
Contributors:	工學院機械工程學系
Keywords:	ADHESION;Applied sciences;CATALYSTS;Chitosan;COPOLYMERS;Copper;Cross-disciplinary physics: materials science;rheology;Droplets;Electric potential;Electroless plating;Exact sciences and technology;GLASSES;Indium tin oxide;Ink-jet printing;Materials science;Metallic coatings;Metals. Metallurgy;Palladium;Palladium nanoparticles;Physics;PLATING;POLYMERS;Production techniques;Surface treatment;Surface treatments
Date:	2014-01-01
Issue Date:	2026-04-23 15:15:58 (UTC+8)
Publisher:	Elsevier;Amsterdam: Elsevier B.V
Abstract:	摘要： In this work, pH-sensitive chitosan (CTS)-g-polyvinyl acetate (PVAc) copolymer was used to self-reduce Pd nanoparticles (PdNPs). By heating the aqueous solution in the presence of metal ions and CTS-g-PVAc, the metal nuclei reduced within the core. Since the amino group in chitosan has a pKa value of ~6.5, thus, chitosan is positively charged (NH3+) in acidic or neutral solution, whereas it turns to neutral in an alkaline solution. The pH-sensitive CTS chains not only function as stabilizing agent for noble metal nanoparticles in ink solution but also enhance the adhesion between PdNPs and substrate during the electroless deposition of Cu lines. Therefore, the Cu line with dramatically enhanced adhesion is formed on the surface of indium tin oxide (ITO) glass substrate without special pretreatment step before electroless deposition of Cu lines. The obtained pattern could be effectively controlled by adjusting the parameters including printing droplet spacing, operating voltages, substrate temperature, electroless plating time and temperature. Optical microscope observation showed that a continuous pattern was formed with a printing voltage of 37V, space of drop was about 30μm and the substrate temperature was 50°C. When eletroless plating with plating solution at 60°C and at pH of 12.5, the smallest metallic line formed in this study is about 40μm. •The pH-sensitive copolymer was used to self-reduce Pd nanoparticles.•Cu pattern is deposited by ink-jet printing and electroless Cu deposition.•The Cu wire was successfully fabricated, which may greatly apply to solar cell. 出版者： Amsterdam: Elsevier B.V 出版日期： 2014 出處： Surface & coatings technology, 2014, Vol.259, p.340-345 版權： 2014 Elsevier B.V. 版權： 2015 INIST-CNRS 識別號： ISSN: 0257-8972 識別號： EISSN: 1879-3347 識別號： DOI: 10.1016/j.surfcoat.2014.02.031 識別號： CODEN: SCTEEJ
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