LTCC 陶瓷基板雷射切割研究

NCUIR > Engineering College > Graduate Institute of opto-Mechatronics > Electronic Thesis & Dissertation > Item 987654321/1682

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/1682

Title:	LTCC 陶瓷基板雷射切割研究
Authors:	許世宗;SHIH-TSUNG HSU
Contributors:	光機電工程研究所
Keywords:	陶瓷基板;雷射切割;ceramic substrate;Laser cutting
Date:	2008-07-17
Issue Date:	2009-09-21 09:57:37 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	本研究主要使用CO2 雷射與運用控制破裂切割原理在陶瓷基板切割。並使用所建立的雷射切割平台，來驗證破裂控制切割原理與實際應用在LED 低溫共燒陶瓷基板上。 Localized heating by CO2 laser followed by water quenching was applied to control fracture growth for cutting ceramic substrate. The process was successfully demonstrated on breaking LED LTCC ceramic substrate with a laser cutting platform
Appears in Collections:	[Graduate Institute of opto-Mechatronics] Electronic Thesis & Dissertation

Files in This Item:

File	Size	Format

社群 sharing