液態錫(銀、銅、鎳、銦)合金的表面氧化行為研究; Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys

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Title:	液態錫(銀、銅、鎳、銦)合金的表面氧化行為研究;Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys
Authors:	李彥佑;Yen-Yu Lee
Contributors:	材料科學與工程研究所
Keywords:	無鉛焊料;氧化;電動勢;lead-free solder;oxidation;electromotive force
Date:	2009-06-04
Issue Date:	2009-09-21 11:29:29 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	本研究主要探討液態錫(銀、銅、鎳、銦)合金的表面氧化行為，我們認為表面氧化層的結構(相和密度)對錫合金的表面氧化形成是主要的關鍵因素，另外我們發現焊料合金的添加合金元素，對錫表面氧化層的結構(相和密度)有很大的影響，我們發現可以從添加合金元素的電動勢(electromotive force, EMF) 及氧化物形成的自由能大小，而預測添加合金元素對表面的氧化影響行為。本研究之添加合金元素可分為:氧化增強及氧化減緩兩類，當以上兩種合金元素同時添加入錫時，錫表面的氧化行為可能被其中某一添加元素主導，主導元素的決定與添加合金元素的濃度比例有極大的關連性，添加合金元素對表面氧化行為的影響將在本文中作深入討論，且提出詳細的機制。 The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. And, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives’ EMF values and Gibbs free energies of oxide formation. The detail effect (either retarding or enhancing) of the additives on the surface oxidation would be discussed and proposed in this paper.
Appears in Collections:	[Institute of Materials Science and Engineering] Electronic Thesis & Dissertation

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