中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Item 987654321/26559
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 70585/70585 (100%)
造访人次 : 23052371      在线人数 : 491
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/26559


    题名: Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples
    作者: Kao,CR
    贡献者: 化學工程與材料工程學系
    关键词: DIFFUSION CONSTANTS;GROWTH;COPPER;INTERFACE;KINETICS;COUPLES;TIN
    日期: 1997
    上传时间: 2010-06-29 17:31:04 (UTC+8)
    出版者: 中央大學
    摘要: In this study Cu was reacted with pure liquid Sn and liquid Sn saturated with Cu at 240 degrees, 250 degrees, and 275 degrees C. Different microstructures were observed for different liquid Sn baths. For reaction in the Sn bath saturated with Cu, Cu6Sn5 and Cu3Sn with the layered structure formed. The growth follows the parabolic kinetics, suggesting the growth is diffusion-controlled. The apparent activation energy for the parabolic growth constant is 29 kJ mol(-1). For reaction in pure Sn, the reaction produced a very thin and irregular Cu3Sn layer and a thicker Cu6Sn5 region with long protrusions into the Sn region. In addition to the diffusional reaction, Cu dissolved very rapidly into the pure liquid Sn bath. It is proposed that the formation of the non-planar structure is due to the rapid dissolution of Cu6Sn5 into the liquid Sn. Similar behaviors were observed for the reaction between Ni and liquid Bi as well as between Cu and liquid In. For Ni reacted in liquid Bi saturated with Ni at 300 degrees C, NiBi3, formed with the layered structure. For Ni reacted in pure liquid Bi, NiBi3 formed with an irregular structure. For Cu reacted in liquid In saturated with Cu at 200 degrees C, Cu11In9 formed with the layered structure. For Cu reacted in pure liquid In, Cu11In9 formed with an irregular structure; Cu7In3 and Cu2In also formed but were very thin, only a few microns in thickness. (C) 1997 Elsevier Science S.A.
    關聯: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    显示于类别:[化學工程與材料工程研究所] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    index.html0KbHTML290检视/开启


    在NCUIR中所有的数据项都受到原著作权保护.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回馈  - 隱私權政策聲明