Coupling effect in Pt/Sn/Cu sandwich solder joint structures

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29798

Title:	Coupling effect in Pt/Sn/Cu sandwich solder joint structures
Authors:	Wang,S. J.;Liu,C. Y.
Contributors:	材料科學與工程研究所
Keywords:	INTERFACIAL REACTIONS;BUMP METALLURGY;CU;METALLIZATION;SN
Date:	2007
Issue Date:	2010-07-06 15:58:18 (UTC+8)
Publisher:	中央大學
Abstract:	The interaction between Sn/Cu and Sn/Pt interfacial reactions in Pt/Sn/Cu sandwich joint structures was studied. We found the interfacial Sn/Pt reaction to be greatly influenced by the opposite Sn/Cu reaction. The PtSn4 interfacial compound formation rate
Relation:	ACTA MATERIALIA
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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