Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29844

Title:	Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints
Authors:	Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
Contributors:	材料科學與工程研究所
Keywords:	UNDER-BUMP-METALLIZATION;INTERFACIAL REACTIONS;CU CONCENTRATION;SURFACE FINISH;NI;DISSOLUTION
Date:	2006
Issue Date:	2010-07-06 15:59:12 (UTC+8)
Publisher:	中央大學
Abstract:	Eutectic PbSn flip chip solder joint was subjected to 5 X 10(3) A/cm(2) current stressing at 150 degrees C and 3.5 X 10(4) A/cm(2) current stressing at 30 degrees C. The under bump metallurgy (UBM) on the chip was sputtered Ni/Cu, and the substrate side w
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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