Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer

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Title:	Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layer
Authors:	Hsiao YH,Chuang YC,Liu CY
Contributors:	材料科學與工程研究所
Keywords:	EUTECTIC SNPB;SOLDER JOINTS
Date:	2006
Issue Date:	2010-07-06 15:59:26 (UTC+8)
Publisher:	中央大學
Abstract:	Electromigration-induced Cu dissolution occurred at serious levels on the Cu pad under 10(4) A/cm(2) current-stressing for 20 h at 160 degrees C. A high electromigration-resistance (Cu, Ni)(6)Sn-5 layer, which converted from a thin Ni layer on the Cu pad,
Relation:	SCRIPTA MATERIALIA
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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