| 題名: | Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps |
| 作者: | Liu,C. Y.;Ke,Lin;Chuang,Y. C.;Wang,S. J. |
| 貢獻者: | 材料科學與工程研究所 |
| 關鍵詞: | FAILURE;JOINTS;DIFFUSION;COPPER;ALLOY;AG |
| 日期: | 2006 |
| 上傳時間: | 2010-07-06 15:59:28 (UTC+8) |
| 出版者: | 中央大學 |
| 摘要: | The Cu consumption in flip-chip Sn/Cu solder joint structures, both with and without current stressing was studied. The Cu consumption activation energy without current stressing was determined to be 0.93 eV. With current stressing, the Cu consumption act |
| 關聯: | JOURNAL OF APPLIED PHYSICS |
| 顯示於類別: | [材料科學與工程研究所 ] 期刊論文
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