In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

NCUIR > Engineering College > Institute of Materials Science and Engineering > journal & Dissertation > Item 987654321/29872

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Title:	In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
Authors:	Lin,YH;Hu,YC;Tsai,CM;Kao,CR;Tu,KN
Contributors:	材料科學與工程研究所
Keywords:	UNDER-BUMP-METALLIZATION;ELECTROMIGRATION-INDUCED FAILURE
Date:	2005
Issue Date:	2010-07-06 15:59:48 (UTC+8)
Publisher:	中央大學
Abstract:	The electromigration of PbSn eutectic flip-chip solder joints was studied at 30 degrees C with a nominal current density of 4 x 10(4) A/cm(2). The void formation-and-propagation failure mechanism was observed in situ. In the joint with electrons flowing f
Relation:	ACTA MATERIALIA
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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