Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations

NCUIR > Engineering College > Institute of Materials Science and Engineering > journal & Dissertation > Item 987654321/29874

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29874

Title:	Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations
Authors:	Luo,WC;Ho,CE;Tsai,JY;Lin,YL;Kao,CR
Contributors:	材料科學與工程研究所
Keywords:	AU/NI SURFACE FINISH;LEAD-FREE SOLDERS;MICROELECTRONIC PACKAGES;INTERFACIAL REACTIONS;ELECTRONIC PACKAGES;COPPER-TIN;JOINTS;METALLIZATION;TECHNOLOGY;SUBSTRATE
Date:	2005
Issue Date:	2010-07-06 15:59:50 (UTC+8)
Publisher:	中央大學
Abstract:	It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to inve
Relation:	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	646	View/Open

社群 sharing