| 題名: | Electromigration studies of Cu/carbon nanotube composite interconnects using Blech structure |
| 作者: | Chai,Yang;Chan,Philip C. H.;Fu,Yunyi;Chuang,Y. C.;Liu,C. Y. |
| 貢獻者: | 化學工程與材料工程研究所 |
| 關鍵詞: | CARBON NANOTUBES;ALLOYING ELEMENTS;CU;MATRIX |
| 日期: | 2008 |
| 上傳時間: | 2010-07-06 16:14:54 (UTC+8) |
| 出版者: | 中央大學 |
| 摘要: | The electromigration (EM) properties of pure Cu and Cu/carbon nanotube (CNT) composites were studied using the Blech test structure. Pure Cu and Cu/CNT composite segments were subjected to a current density of 1.2 x 10(6) A/cm(2). The average void growth |
| 關聯: | IEEE ELECTRON DEVICE LETTERS???? |
| 顯示於類別: | [化學工程與材料工程研究所] 期刊論文
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