Cross-interaction between Ni and Cu across Sn layers with different thickness

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30302

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30302

Title:	Cross-interaction between Ni and Cu across Sn layers with different thickness
Authors:	Chang,Chien Wei;Yang,Su Chun;Tu,Chun-Te;Kao,C. Robert
Contributors:	化學工程與材料工程研究所
Keywords:	LEAD-FREE SOLDERS;INTERFACIAL REACTIONS;SURFACE FINISH;DIFFUSION;JOINTS;COPPER;TIN
Date:	2007
Issue Date:	2010-07-06 16:16:23 (UTC+8)
Publisher:	中央大學
Abstract:	The Ni/solder/Cu material sequence is one of the most common material sequences in the solder joints of electronic packages. In this study, the Ni/Sn/ Cu ternary diffusion couples were used to investigate the solder volume effect on the cross-interaction
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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