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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30316

    Title: Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints
    Authors: Liu,CY;Chen,JT;Chuang,YC;Ke,L;Wang,SJ
    Contributors: 化學工程與材料工程研究所
    Keywords: EUTECTIC SNPB;CU
    Date: 2007
    Issue Date: 2010-07-06 16:16:40 (UTC+8)
    Publisher: 中央大學
    Abstract: Polarity void formation has been observed at the Cu3Sn/Cu interfaces in current-stressed Cu/Sn/Cu flip-chip joints. Electromigration voids were observed at the Cu3Sn/Cu anode interface, but no voids were found at the Cu3Sn/Cu cathode interface. The backst
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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