Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30336

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Title:	Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element
Authors:	Yang,S. C.;Ho,C. E.;Chang,C. W.;Kao,C. R.
Contributors:	化學工程與材料工程研究所
Keywords:	AG-CU SOLDERS;INTERFACIAL REACTIONS;BUMP METALLIZATION;NI
Date:	2007
Issue Date:	2010-07-06 16:17:09 (UTC+8)
Publisher:	中央大學
Abstract:	Massive spalling of intermetallic compounds has been reported in the literature for several solder/substrate systems, including SnAgCu soldered on Ni substrate, SnZn on Cu, high-Pb PbSn on Cu, and high-Pb PbSn on Ni. In this work, a unified thermodynamic
Relation:	JOURNAL OF APPLIED PHYSICS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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