Kinetics of AuSn4 migration in lead-free solders

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30426

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30426

Title:	Kinetics of AuSn4 migration in lead-free solders
Authors:	Chang,C. W.;Ho,C. E.;Yang,S. C.;Kao,C. R.
Contributors:	化學工程與材料工程研究所
Keywords:	AU/NI SURFACE FINISH;NI/AU METALLIZATION;PB-FREE;INTERFACIAL MICROSTRUCTURE;MICROELECTRONIC PACKAGES;INTERMETALLIC LAYER;ELECTRONIC PACKAGES;JOINTS;AU;CU
Date:	2006
Issue Date:	2010-07-06 16:19:08 (UTC+8)
Publisher:	中央大學
Abstract:	The relatively fast diffusion of An atoms in eutectic PbSn matrix is considered one of the contributing factors to the Au embrittlement problem. In this study, we further investigated the Au embrittlement problem in high-Sn solders. Experimentally, Sn3.5A
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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