Impact of Cu/Mg ratio on thermal stability of hot extrusion of Al-4.6 pct Cu-Mg-Ag alloys

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Title:	Impact of Cu/Mg ratio on thermal stability of hot extrusion of Al-4.6 pct Cu-Mg-Ag alloys
Authors:	Chang,Chih-Hong;Lee,Sheng-Long;Hsu,Tiz-Yu;Lin,Jing-Chie
Contributors:	機械工程研究所
Keywords:	ELECTRICAL-RESISTIVITY;ELEVATED-TEMPERATURES;AL-4.6CU-0.3MG ALLOY;SMALL ADDITIONS;ZONE FORMATION;GP ZONES;PRECIPITATION;OMEGA;NUCLEATION;SILVER
Date:	2007
Issue Date:	2010-07-06 16:20:18 (UTC+8)
Publisher:	中央大學
Abstract:	This work explores how the Cu/Mg ratio affects the thermal stability of the extrusion of Al-4.6 pct Cu-Mg-Ag alloys at aerodynamic heating temperatures of up to 155 degrees C for 1000 hours. The Cu/Mg ratio was modified by adding various amounts of elemen
Relation:	METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Appears in Collections:	[Graduate Institute of Mechanical Engineering] journal & Dissertation

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