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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30587


    Title: An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices
    Authors: Liu,CY;Wang,SJ
    Contributors: 化學工程與材料工程研究所
    Keywords: SOLDER
    Date: 2004
    Issue Date: 2010-07-06 16:22:46 (UTC+8)
    Publisher: 中央大學
    Abstract: By studying reactions between Au foils and Sn(Cu) alloys, we found that the Au consumption rate depended on the Cu-content of the Sn(Cu) solders. The higher Cu-content alloys had faster Au consumption rates. When the Au foil was pre-coated with a Ni layer
    Relation: JOURNAL OF MATERIALS RESEARCH
    Appears in Collections:[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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