Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30599

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30599

Title:	Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints
Authors:	Tsai,CM;Luo,WC;Chang,CW;Shieh,YC;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	LEAD-FREE SOLDERS;INTERFACIAL REACTIONS;COMPOUND FORMATION;CU CONCENTRATION;MICROELECTRONIC PACKAGES;SHEAR-STRENGTH;NI;METALLIZATION;AU/NI;TECHNOLOGY
Date:	2004
Issue Date:	2010-07-06 16:23:04 (UTC+8)
Publisher:	中央大學
Abstract:	The cross-interaction of the under-bump metallurgy (UBM)/solder interface and the solder/surface-finish interface in flip-chip solder joints was investigated. In this study, the UBM on the chip side was a single layer of Cu (8.5 mum), and the surface fini
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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