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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30694


    Title: Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
    Authors: Hsu,SC;Wang,SJ;Liu,CY
    Contributors: 化學工程與材料工程研究所
    Keywords: EUTECTIC SNPB;SOLDERING REACTION;EVOLUTION;NI
    Date: 2003
    Issue Date: 2010-07-06 16:25:13 (UTC+8)
    Publisher: 中央大學
    Abstract: The effect of Cu content in Sn(Cu) alloys on the interfacial reaction between Ni thin film and Sn(Cu) alloys has been investigated. We have found that the variation of Cu content has a strong influence on the spalling of the Ni thin film. With small Cu ad
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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