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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30708


    Title: Electromigration studies on Sn(Cu) alloy lines
    Authors: Lu,CC;Wang,SJ;Liu,CY
    Contributors: 化學工程與材料工程研究所
    Keywords: EUTECTIC SNPB;CU;INTERCONNECTS;FILMS
    Date: 2003
    Issue Date: 2010-07-06 16:25:31 (UTC+8)
    Publisher: 中央大學
    Abstract: The Cu alloying effect in the Sn(Cu) solder line has been studied. The Sn0.7Cu solder line has the most serious electromigration (EM) damage compared to pure Sn and Sn3.0Cu solder lines. The dominant factor for the fast EM rate in Sn0.7Cu could be attribu
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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