Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30801

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Title:	Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Authors:	Chen,WT;Ho,CE;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	TIN
Date:	2002
Issue Date:	2010-07-06 16:27:40 (UTC+8)
Publisher:	中央大學
Abstract:	The eutectic 99.3Sn-0.7Cu solder (wt%, Sn-0.7Cu) is the most promising lead-free replacement for the eutectic Sn-Pb solder in wave-soldering applications. In this study, the effect of a small perturbation in the Cu concentration on the reaction between th
Relation:	JOURNAL OF MATERIALS RESEARCH
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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