Interactions between solder and metallization during long-term aging of advanced microelectronic packages

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30916

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30916

Title:	Interactions between solder and metallization during long-term aging of advanced microelectronic packages
Authors:	Ho,CE;Chen,WT;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	JOINTS;GROWTH
Date:	2001
Issue Date:	2010-07-06 16:30:23 (UTC+8)
Publisher:	中央大學
Abstract:	The reactions between the eutectic PbSn solder and the Au/Ni/Cu tri-layer metallization in advanced microelectronic packages were studied. In this investigation, reflowed packages were subjected to aging at 160 degreesC for times as long as 4000 h. Immedi
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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