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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/35522

    Title: Thermal reliability and performances of InGaP Schottky contact with Cu/Au and Au/Cu-MSM photodetectors
    Authors: Tsai,CD;Lee,CT
    Contributors: 光電科學與工程學系
    Keywords: TI/PT/AU METALS;GAAS
    Date: 2001
    Issue Date: 2010-07-07 14:34:55 (UTC+8)
    Publisher: 中央大學
    Abstract: We report the Schottky performance and thermal reliability of a wide bandgap InGaP layer in contact with a Cu/Au metallic system. An effective Schottky barrier height of 0.97 eV and an ideality factor of 1.21 can be achieved. The thermal reliability of th
    Appears in Collections:[光電科學與工程學系] 期刊論文

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