Siblings Research Project [41/41] Electronic Thesis & Dissertation [278/278] retired tests [35/35] Collection Statistics Item counts issued in 3 years: 0(0.00%) Items With Fulltext: 18(100.00%) Download counts of the item Download times greater than 0: 18(100.00%) Download times greater than 100: 3(16.67%) Total Bitstream Download Counts: 3553(0.82%) Last Update: 2026-06-26 21:54 Top Upload Loading... Top Download Loading... Recent Submissions 清初漢文人心態的轉變及其對詩詞風氣的影響－以康熙十八年（1679）博學... Write current self-configuration sc... RRAM defect modeling and failure an... Reactivation of spares for off-chip... On improving interconnect defect di... Low-cost post-bond testing of 3-D I... Low-cost error tolerance scheme for... In-situ method for TSV delay testin... Generalization of an enhanced ECC m... DArT: A component-based DRAM area, ...

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Showing items 1-18 of 18. (1 Page(s) Totally) 1  View [10|25|50] records per page

Date	Title	Authors
2016-09-01	清初漢文人心態的轉變及其對詩詞風氣的影響－以康熙十八年（1679）博學鴻儒科為考察中心	王力堅; Lijian), 王力堅(WANG
2016-04-01	Configurable Cubical Redundancy Schemes for Channel-Based 3-D DRAM Yield Improvement	鄭政誠; Lin, Bing-Yang; Chiang, Wan-Ting; Wu, Cheng-Wen; Lee, Mincent; Lin, Hung-Chih; Peng, Ching-Nen; Wang, Min-Jer
2016-03-01	A local parallel search approach for memory failure pattern identification	鄭政誠; Lin, Bing-Yang; Wu, Cheng-Wen; Lee, Mincent; Lin, Hung-Chih; Peng, Ching-Nen; Wang, Min-Jer
2015-01-01	RRAM defect modeling and failure analysis based on march test and a novel squeeze-search scheme	鄭政誠; Chen, Ching-Yi; Shih, Hsiu-Chuan; Wu, Cheng-Wen; Lin, Chih-He; Chiu, Pi-Feng; Sheu, Shyh-Shyuan; Chen, Frederick T.
2014-11-01	Low-cost post-bond testing of 3-D ICs containing a passive silicon interposer base	鄭政誠; Chi, Chun-Chuan; Marinissen, Erik Jan; Goel, Sandeep Kumar; Wu, Cheng-Wen
2014-02-01	Application-independent testing of 3-D field programmable gate array interconnect faults	鄭政誠; Peng, Yen-Lin; Kwai, Ding-Ming; Chou, Yung-Fa; Wu, Cheng-Wen
2014-01-01	DArT: A component-based DRAM area, power, and timing modeling tool	鄭政誠; Shih, Hsiu-Chuan; Luo, Pei-Wen; Yeh, Jen-Chieh; Lin, Shu-Yen; Kwai, Ding-Ming; Lu, Shih-Lien; Schaefer, Andre; Wu, Cheng-Wen
2014-01-01	On improving interconnect defect diagnosis resolution and yield for interposer-based 3-D ICs	鄭政誠; Chi, Chun-Chuan; Lin, Bing-Yang; Wu, Cheng-Wen; Wang, Min-Jer; Lin, Hung-Chih; Peng, Ching-Neng
2013-06-05	Generalization of an enhanced ECC methodology for low power PSRAM	鄭政誠; Chen, Po-Yuan; Su, Chin-Lung; Chen, Chao-Hsun; Wu, Cheng-Wen
2013-01-01	Write current self-configuration scheme for MRAM yield improvement	鄭政誠; Chen, Ching-Yi; Wang, Sheng-Hung; Wu, Cheng-Wen
2013-01-01	AC-plus scan methodology for small delay testing and characterization	鄭政誠; Li, Tsung-Yeh; Huang, Shi-Yu; Hsu, Hsuan-Jung; Tzeng, Chao-Wen; Huang, Chih-Tsun; Liou, Jing-Jia; Ma, Hsi-Pin; Huang, Po-Chiun; Bor, Jenn-Chyou; Tien, Ching-Cheng; Wang, Chih-Hu; Wu, Cheng-Wen
2013-01-01	In-situ method for TSV delay testing and characterization using input sensitivity analysis	鄭政誠; You, Jhih-Wei; Huang, Shi-Yu; Lin, Yu-Hsiang; Tsai, Meng-Hsiu; Kwai, Ding-Ming; Chou, Yung-Fa; Wu, Cheng-Wen
2013-01-01	Low-cost error tolerance scheme for 3-D CMOS imagers	鄭政誠; Chang, Hsiu-Ming Chang; Huang, Jiun-Lang; Kwai, Ding-Ming; Cheng, Kwang-Ting; Wu, Cheng-Wen
2013-01-01	Reactivation of spares for off-chip memory repair after die stacking in a 3-D IC with TSVs	鄭政誠; Chou, Yung-Fa; Kwai, Ding-Ming; Shieh, Ming-Der; Wu, Cheng-Wen
2012-11-01	A study on electric properties for pulse laser annealing of ITO film after wet etching	鄭政誠; Lee, C.J.; Lin, H.K.; Li, C.H.; Chen, L.X.; Lee, C.C.; Wu, C.W.; Huang, J.C.
2010	Jesus in Beijing: How Christianity is Transforming China and Changing the Global Balance of Power	Wang,PCM
2009	Revisiting US-China Wartime Relations: a study of Wedemeyer's China mission	Wang,PCM
1987	COMMUNIST-CHINA AND RELIGION - WANG,HW	TSAI,KY

Showing items 1-18 of 18. (1 Page(s) Totally) 1  View [10|25|50] records per page