晶圓針測參數實驗與模擬分析; Wafer probing analysis of the experiment and simulation parameters

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Title:	晶圓針測參數實驗與模擬分析;Wafer probing analysis of the experiment and simulation parameters
Authors:	林暘烈;Yang-Lie Lin
Contributors:	機械工程研究所碩士在職專班
Keywords:	有限元素分析;針測;探針卡;probe card;finite element analysis;Probing
Date:	2011-01-21
Issue Date:	2011-06-04 15:02:23 (UTC+8)
Publisher:	國立中央大學
Abstract:	本研究目的在探討針測行程、次數、接觸力與針尖長度對晶圓針測用探針結構強度之影響，以期提供設計探針幾何參數之參考。研究內容運用田口方法的特點，規劃多項不同針測行程、接觸力及針尖長度組合之實驗，尋求影響探針強度的主要因素。另外，利用ABAQUS有限元素分析軟體，模擬不同實驗參數組合之探針應力分佈狀態，依據von Mises 降伏準則來判斷探針材料是否產生損壞，並與實際針測實驗之結果，進行比對分析，以暸解探針損壞現象及預測探針損壞條件。最後觀察在累積針測次數500及50,000次的條件下，產生探針結構損壞之不同針測行程、針尖長度及接觸力參數組合的條件。 The purpose of this study is to investigate the effects of over-drive, number of probing test, contact force and probe tip length on the structural strength of probes for wafer test. Taguchi methods were applied to design the　experiments using probes with various combinations of over-drive, contact force and probe tip length so as to find out the key parameter in determining the structural strength of a probe. A commercial fine element analysis (FEA) code, ABAQUS, was employed to simulate the mechanical behavior of the probe during wafer testing with various combinations of probing parameters. The von Mises yield criterion was applied to asses whether a probe was failed based on the stress analysis results of FEA modeling. Another set of probing test was conducted to find out the proper combinations of probing parameters to survive 500 or 50,000 times of probing test.
Appears in Collections:	[Executive Master of Mechanical Engineering] Electronic Thesis & Dissertation

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