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    题名: 微機電整合技術製作毫米波感測元件暨系統;Integrated Manufacturing for Millimeter-Wave Sensing Systems
    作者: 傅尹坤
    贡献者: 機械工程學系
    关键词: 整合毫米波系統;MMIC / Si IC 元件;微塑膠成型;內渠道微電鍍;波導管;號角天線陣列;HFSS 參數最佳化;S-parameter;Integrated millimeter-wave system;MMIC / Si IC;polymer micro-molding;in-channel electroplating;waveguide;horn antenna array;HFSS parametric optimization;interfacial micro-bonding;S-parameter;機械工程類;電子電機工程類
    日期: 2010-01-01
    上传时间: 2011-07-12 13:57:16 (UTC+8)
    出版者: 行政院國家科學委員會
    摘要: 本計畫提出整合毫米波系統結構,結合前端與MMIC / Si IC 元件,以微塑膠成型和微電鍍為基礎之前端加工的系統。計畫的第一項目標是成本和尺寸的降低與縮小。我們希望開發一種低成本、整合的前端製造系統(integrated front-end manufacturing system),並使用現有的毫米波器的概念與微加工的新方法,如微電鍍和微塑膠成型來達成低成本、可攜式的毫米波系統。應用範圍包括汽車防撞雷達、行動雷達和衛星上行/下行系統。本計劃第一年將開發微成型與微電鍍模組製程, 因為一般在高頻波段系統(W-band , 75-110GHz) 之傳輸均採用波導管 (waveguide)來降低傳輸之損耗,因此相關之毫米波雷達系統均非常龐大且製造費用高昂。傳統製程需要以個別精密機械加工次系統,如波導管,天線,偶合器等,再搭配特殊fixture 來做精密組裝;因此其系統非常昂貴,動輒達數百萬美金。所以新的製程開發將有助於微型化與低價化之應用。第二年為汽車防撞雷達所需之毫米波雷達前端系統進行之研究。進行相關元件設計如號角天線(horn antenna)和參數最佳化,整合微電鍍及微成形的三維毫米波前端系統(包含W-band 矩形波導管 (rectangular waveguide)、天線、耦合器(coupler)等),微封裝製程(encapsulation through in-channel electroplating),粗糙度及密閉性量測,探討材料之介面接合特性,S-parameter 量測,天線性能量測。 Millimeter-wavelength sensing system (radar) is the key technology to detect remote objects. The current manufacturing process of a millimeter-wave sensing system fabricates metallic components (such as waveguides, antennas, and couplers) individually using fine machining and manual assembly. This results in expensive mm-wave system. To reduce the system cost, this project aims to develop low-cost and integrated manufacturing processes for mm-wave front-end using new concepts/approaches, in particular, a W-band (75-110GHz) mm-wave system. The ultimate objective is to build future generations of low-cost, high-performance, automotive collision avoidance systems. In the first year, a 3D fabrication process to integrate mm-wave components (horn/patch antenna, waveguide, coupler, electronics) will be developed. In particular, the process will involve multiple layers to enable routing/interconnects (waveguides and/or transmission lines, control lines) for mm-wave components and integration of components and electronics (MMIC / Si IC) into plastic front-end as well as enable interfaces for testing of prototypes. In order to demonstrate the capability of integration with other millimeter-wave components, a 2×2 horn antenna array feeding network has been designed and optimized using HFSS simulations/parametric optimization in the second year, based on the integrated manufacturing modules developed in the first year. The components such as resonant cavities, T-junction with power splitters, horn antennas, E-plane bend and feeding waveguide networks, are achieved by using a single shot micro-molding process. In addition, the proposed integrated manufacturing is to use micro molding techniques and in-channel electroplating to fabricate three-dimensional structures combing antenna, splitter, phase shifter, waveguides and other passive mechanical components in a batch process. The dramatic different as compared to the traditional system is the batch process to reduce the manufacturing cost and the miniaturization of the system. . The process starts with the fabrication of an upper mold insert piece by mechanical machining process to construct the horn pattern and another lower mold insert piece to construct the WR-10 rectangular waveguide networks. Preliminary research indicates the waveguide feeding network play a significant role in reflection loss and radiation pattern as well as antenna gain in both E and H directions. Antenna parameters such as S-parameters and radiation pattern will be measured and compared with simulation results to validate the simulation processes. 研究期間:9901 ~ 9912
    關聯: 財團法人國家實驗研究院科技政策研究與資訊中心
    显示于类别:[機械工程學系] 研究計畫

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