| 摘要: | LED因具有體積小、壽命長、操作反應快、可靠度高、高發光效率、色彩飽和的優點，加上無含汞符合環保要求，LED已是未來二十一世紀兼具節能與環保之照明光源。LED晶片之發光效率，一直逐年在快速的提升中，達到每瓦200流明的終極目標可望在數年後達到，屆時LED光源便會成為最普遍使用之照明光源。然而，若將LED應用於照明系統中，仍有光學效率及散熱的兩大問題，有鑑於此，我們結合在LED領域中多位具有專長教授之研究能量，提出了一個整合型的計畫，以兼顧高光學效能表現之LED光源設計及照明應用和超低熱阻之封裝技術及量測分析方法為重點，以期早日達到以LED光源全面取代傳統照明器具之目標。為了改善解決LED應用於照明中的兩大問題：光學效率及散熱。於本計畫中，我們從多年的光學研究經驗出發，設計及製作以LED為光源之高效率散射元件。本設計不但可得到一均勻光型且可任意調制不同形狀之光型以利各種光學整合或者各式照明之應用。與一般散射元件相較，其光學效率大幅提升且可控制光場之發散角以避免能量不當使用及眩光。此外，我們更藉由LED晶粒封裝於具Cu thermal via之矽基座的製程開發，發展超低熱阻之封裝技術，並利用非接觸式熱阻量測系統，量測整體模組之排熱效能，使LED模組具有優異之熱傳導效率已達節能之功效。最後，整合三個子計畫，提供行政與儀器支援，並在子計畫完成光熱元件與熱阻評估同時，製作以上述的元件所組成的高效能模組，並將之展示給台灣的LED產業界，藉由完整技術的展示與性能的表現，將促使產業界能積極技轉相關技術以提升節能產業的競爭力。 LED have been regarded as the most possible new light source in the next-generation lighting owing to its small volume, long life, fast response, high reliability, high efficiency, high color purity and environmental benefit. Recently, the luminous efficiency has been dramatically increased owing to many efforts in material engineering. So most people believe that the luminous efficiency may reach 200 lm/W in several years, and then LEDs should replace most light sources in the world. However, the optical efficiency and heat, two important issues still exist in LED lighting system. Therefore, we propose an integration project, where three professors working in different segments in LED research join together to study the optics, package, and measurement for the high performance in lighting and ultra-low thermal resistance. For improving two import issues in LED lighting, optical efficiency and heat treatment. In the integrating project, we will start from our experience in precise optical model and optical design in LED optics to design and manufacture high efficiency scattering element based on LED. Using the element, we will improve the optical efficiency in LED lighting. Various applications of optical and lighting system will obtain the uniform and arbitrary-control light pattern by our design. Compared with general scattering elements, our design will be useful for the improvement of optical efficiency, the control of diverging angle, and the appearance of glare. Besides, we develop a process of silicon-based sub-mount substrate with Cu thermal via with the bonds of LED chip. Using this process, the package technology about ultra-low thermal resistance will be developed. We will also use a non-touch measurement system for thermal resistance to measure the thermal conductive capability of whole module. Keeping this LED module will has excellent thermal conductive capability and the energy-saving effort. Finally, we will integrate three sub-projects and provide the support in administrations and instruments. After the accomplishments of optical-thermal element and thermal resistance measurement, a high performance module which combined with the above elements will be presented to LED industry in Taiwan. We wish the industry in Taiwan which can improve the competitiveness in energy-saving industry by the integrated technology and excellent performance 研究期間：10001 ~ 10012 |
