Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates

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题名:	Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates
作者:	Huang,TS;Tseng,HW;Hsiao,YH;Cheng,CH;Lu,CT;Liu,CY
贡献者:	化學工程與材料工程學系
关键词:	LEAD-FREE SOLDERS;VOID FORMATION;JOINTS;RELIABILITY;EVOLUTION;LAYERS
日期:	2011
上传时间:	2012-03-27 16:26:31 (UTC+8)
出版者:	國立中央大學
摘要:	(111) and (220) preferred-orientation Cu substrates were successfully produced by varying electroplating current-density. While these preferred-orientation Cu substrates reacted with Sn, serious Kirkendall voids formed at the interfaces between Sn and (111) and (220) preferred-orientation Cu substrates. Also, abnormal Cu(3)Sn growth occurs; the Cu(3)Sn layer decreased upon aging and vanished after 1000-h aging. With a prolonged 2000-h aging, a Cu(3)Sn layer re-grew at the Cu(6)Sn(5)/Cu interface. The abnormal Cu(3)Sn growth was found to highly associate with serious Kirkendall formation (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3608248] All rights reserved.
關聯:	ELECTROCHEMICAL AND SOLID STATE LETTERS
显示于类别:	[化學工程與材料工程學系 ] 期刊論文

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