Preparation and Properties of Four-component Copolymers Applied in Negative-type Photoresists

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Title:	Preparation and Properties of Four-component Copolymers Applied in Negative-type Photoresists
Authors:	Huang,HY;Chen,H;Hsu,MY
Contributors:	化學工程與材料工程學系
Keywords:	ACRYLATE PHOTORESIST;METHACRYLATE;POLYMERS;POLYMERIZATION;RESIST;SILICA;ACID
Date:	2011
Issue Date:	2012-03-27 16:27:33 (UTC+8)
Publisher:	國立中央大學
Abstract:	A series of cyclic monomers were polymerized by free-radical polymerization and used as polymer binders in negative-type photoresists. Thermal properties of the polymer binders and mechanical properties of the pattern were studied. We used four-component polymer binders consisting of methacrylic acid, styrene, isobornyl methacrylate (IBMA), and phenylmaleimide (PMI). The glass transition temperature (T(g)) and thermal decomposition temperature (T(d)) of polymer binders increased with PMI content because of the rigid characteristics of PMI's molecular structure. Elastic recovery and compression of the patterns were measured using a nanoindenter. The patterns exhibited excellent mechanical properties, presumably due to the rigid characteristics of PMI and IBMA's molecular structures. Patterns of a photo spacer were observed by scanning electron microscopy. Addition of carboxylic acid segments of a cross-linker improved the effectiveness of development in negative-type photoresists, and conical patterns were obtained due to decreased intensity of the inter-penetration network.
Relation:	JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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