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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/50113


    Title: Magnetic field-assisted electrochemical discharge machining
    Authors: Cheng,CP;Wu,KL;Mai,CC;Hsu,YS;Yan,BH
    Contributors: 機械工程學系
    Keywords: CHEMICAL ENGRAVING SACE;GRAVITY-FEED;GLASS;ECDM
    Date: 2010
    Issue Date: 2012-03-27 17:03:45 (UTC+8)
    Publisher: 國立中央大學
    Abstract: Electrochemical discharge machining (ECDM) is an effective unconventional method for micromachining in non-conducting materials, such as glass, quartz and some ceramics. However, since the spark discharge performance becomes unpredictable as the machining depth increases, it is hard to achieve precision geometry and efficient machining rate in ECDM drilling. One of the main factors for this is the lack of sufficient electrolyte flow in the narrow gap between the tool and the workpiece. In this study a magnetohydrodynamic (MHD) convection, which enhances electrolyte circulation has been applied to the ECDM process in order to upgrade the machining accuracy and efficiency. During electrolysis in the presence of a magnetic field, the Lorenz force induces the charged ions to form a MHD convection. The MHD convection then forces the electrolyte into movement, thus enhancing circulation of electrolyte. Experimental results show that the MHD convection induced by the magnetic field can effectively enhance electrolyte circulation in the micro-hole, which contributes to higher machining efficiency. Micro-holes in glass with a depth of 450 mu m are drilled in less than 20 s. At the same time, better electrolyte circulation can prevent deterioration of gas film quality with increasing machining depth, while ensuring stable electrochemical discharge. The improvement in the entrance diameter thus achieved was 23.8% while that in machining time reached 57.4%. The magnetic field-assisted approach proposed in the research does not require changes in the machining setup or electrolyte but has proved to achieve significant enhancement in both accuracy and efficiency of ECDM.
    Relation: JOURNAL OF MICROMECHANICS AND MICROENGINEERING
    Appears in Collections:[機械工程學系] 期刊論文

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