在本論文中，提出在陶瓷基板實現高速穿孔架構之5-Gbps光學連接模組，以系統級封裝(System in Package, SiP)之技術，將光學次封裝平台(Optical Sub-Assembly, OSA)、發射端驅動IC和接收端TIA整合至陶瓷基板上，其中發射端驅動IC和接收端TIA的封裝是以覆晶接合(Flip-Chip Bonding)方式所完成，且以高速穿孔連接光學次封裝平台與印刷電路板之間的三維訊號傳遞。首先，我們從設計端評估適用於此模組的被動電路，包含高速穿孔、單端訊號(Single-Ended)傳輸線和差動訊號(Differential)傳輸線的散射參數(Scattering Parameter)模擬和量測;傳輸線和高速穿孔架構是以共平面波導(Coplanar Waveguide, CPW)的方式來設計。由高速穿孔和差動傳輸線所構成之被動電路，當操作頻率為5-GHz時，其反射損耗約為-11.84 dB而插入損耗約為-1.7 dB。在整體模組的高頻特性上，實際量測5-Gbps眼圖，證明高速穿孔與光連接垂直整合架構是具有可行性的和未來發展的潛力。In this thesis, a 5-Gbps optical interconnect module realized on a ceramic substrate with high-speed via-holes is proposed. An optical sub-assembly (OSA), a transmitter driver IC, and a receiver TIA are combined on a ceramic substrate using the system in packaging (SIP) technology. In the packaging approaches, the transmitter driver IC and receiver TIA are assembled using the flip-chip bonding method. Then, the solder bumps are applied to assemble the proposed optical interconnect module onto the printed circuit board (PCB). Finally, high-speed via-holes provide 3-D signal connectivity between OSA and PCB. As a result, a 3-D optical interconnect module has been demonstrated. In the design, the simulation and measurement results of S-parameters are analyzed for the passive circuit with high-speed via-holes, single-ended transmission lines, and differential transmission lines. Both high-speed via-holes and transmission lines are designed based on the coplanar waveguide structure. The module consisting of high-speed via-holes and differential transmission lines is also analyzed. Its return loss and insertion loss are -11.84 and -1.7 dB, respectively, at 5-GHz. The eye diagram of whole module has been validated at the data rate of 5-Gbps. The high-speed via-holes in the module is practicable in the application of optical interconnect.