銻化物系列具有高潛力應用於數位電路功能，其中銻化銦鎵合金系統擁有所有化合物半導體塊材中最高的電洞遷移率，而為了實現互補式電路的需求，低功率損耗跟高電洞遷移率的傳輸特性是必須的。本論文以第一型態能帶結構的銻化銦鎵/銻化鋁為標準結構進行材料磊晶與元件設計研究。基於提高磊晶的傳輸特性及元件特性，我們對磊晶做了調整，也同時分析元件電性，來尋找磊晶與元件的最佳化。另一方面，為了電路應用的需要，我們成功以氫氣電漿製作世界第一顆增強型P型通道銻化銦鎵/銻化鋁異質接面場效電晶體。在磊晶方面的調整一共分為三個部份，第一部分是將通道上方磊晶層厚度做調整，藉此提高元件閘極的調控能力；第二部分為調整主動區磊晶層的長晶溫度，藉此將銻化銦鎵/銻化鋁量子井最佳化；第三部分為調整下方的蝕刻停止層與緩衝層厚度，藉此避免次通道效應產生，此外並加入參雜源來提高元件直流與高頻特性。為了進一步提升元件的性能，我們製作次微米T型閘極元件，在閘極長度為0.2 μm，源極與汲極間距2 μm的元件上，臨限電壓為0.62 V。汲極飽和電流於汲極偏壓為-3.0 V時得到66 mA/mm，轉導值為94 mS/mm，高頻增益部分fT、fMAX分別為15 GHz與22.1 GHz。另一方面，我們發現利用氫氣電漿不僅可成功製作增強型元件，氫氣電漿還可以用來修復缺陷和被破壞的晶格，並且提升元件閘極的調變能力。增強型元件在閘極長度為0.2 μm，源極與汲極間距1 μm的元件上，臨界電壓為0.025 V。在汲極偏壓為-3.0 V時，汲極最大飽和電流為61 mA/mm，轉導峰值為83 mS/mm，次臨限擺幅為107 mV/dec，高頻增益部分fT、fMAX分別為14.8 GHz與22.4 GHz。Sb-based materials have demonstrated high potential for high-speed logic and digital electronics due to their highest electron and hole mobilities among compound semiconductors. Added by their low-power consumption, complementary circuit devices can thus be realized using the materials system. We used type-I band-aligned InGaSb/AlSb layer structure for this study. We started with the adjustment of the growth conditions of the epitaxial layer structures to optimize the characteristics of the epi-layers. Subsequently, we analyzed the transfer properties of the fabricated devices to obtain the relationship between the epi-layer and devices. Moreover, we used the hydrogen plasma to fabricate and demonstrate the first enhancement-mode InGaSb/AlSb device in the world.The optimized epi-layers were systematically investigated by three parts: the first one was to reduce the thickness of the structure layer above the channel to improve the gate control capability; the second one was to adjust the growth temperature of the quantum well for optimizing; and the third one was to vary the thickness ratio of etching stop layer and the buffer layer to reduce the second channel effect. Additionally, we added the dopant to enhance the device dc and rf properties. E-beam writing lithography was used to fabricate the submicron T-gate devices in this work. In a device with 0.2 μm gate length and 2 μm source-to-drain spacing, where Vth is about 0.62 V, dc performance of IDSS = 66 mA/mm and gm,peak = 94 mS/mm and rf performance of fT = 15GHz and an fMAX = 22.1 GHz at a drain voltage of -3.0V were successfully demonstrated. On the other hand, we found that the way of hydrogen plasma not only converts the D-mode device to E-mode one, but also improves the defects and the destroyed lattice. In an E-mode device with 0.2 μm gate length and 1 μm source-to-drain spacing, where Vth is about 0.025 V, dc performance of ID,max = 61 mA/mm, gm,peak = 83 mS/mm S.S. = 107 mV/dec and rf performance of fT = 15GHz and an fMAX = 22.1 GHz at a drain voltage of -3.0V were successfully demonstrated.
