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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/62329


    Title: 開發高功率發光二極體用高散熱金屬基板;Develop of High Performance Metal Substrate for High-Power Led Package
    Authors: 劉正毓
    Contributors: 國立中央大學化學工程與材料工程學系
    Keywords: 材料科技
    Date: 2012-12-01
    Issue Date: 2014-03-17 11:30:11 (UTC+8)
    Publisher: 行政院國家科學委員會
    Abstract: 研究期間:10106~10205;Thermal dissipation is one of key issues for the application of high-power GaN LEDs. To achieve an excellent thermal system for high-power LED, an effective thermal substrate is required. The advantages of metal LED heat dissipation substrate are (1) high thermal conductivity and less the effect of CTE(Coefficient of thermal expansion) (2) cost is cheaper than ceramic substrate (3) the metal-core substrate is easy to shape and produce. Currently, metal LED heat dissipation substrate is widely used for high-power LED chips. However, there is no systematical study on investigating the effect of the dimensions on the thermal performance of metal-core substrates. In this project, firstly, we developed a reliable junction-temperature and thermal resistance measurement system for high-power LED on metal substrate. Then, the junction temperatures of LED chips on metal substrates with different material and package type were measured. Then, we can study the effect of LED chip power and metal substrate dimensions on the thermal dissipation of metal substrates. At last, the ultimate light output power of high-power LED chips on various metal substrates would be correlated to the thermal dissipation effectiveness of the metal substrates. Also, we develop a high performance metal LED heat dissipation substrate. It can integrate optical, electrical and thermal effect of high LED package characteristic.
    Relation: 財團法人國家實驗研究院科技政策研究與資訊中心
    Appears in Collections:[化學工程與材料工程學系 ] 研究計畫

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