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    題名: 半導體產業晶圓製造專業化的起源
    作者: 吳昆儒;Wu,Kun-Ju
    貢獻者: 產業經濟研究所在職專班
    關鍵詞: 晶圓製造專業化;台積電;垂直分工;Wafer manufacture;TSMC;vertical disintegration
    日期: 2014-07-24
    上傳時間: 2014-10-15 15:32:04 (UTC+8)
    出版者: 國立中央大學
    摘要: 中文摘要
    半導體產業近代對於我們影響重大,於1987年台積電專業化的晶圓製造廠成立後,產業結構由垂直整合走向垂直分工,所以台積電的成立對於整個半導體產業結構的變化有重大的影響。
    我們從1980年代的產業歷史背景中得知,1981年IBM推出第一台個人電腦,並且由封閉的系統走向開放的系統,個人電腦由垂直整合走向垂直分工,帶動電腦周邊產品的發展及需求,同時又有消費性電子的需求,這些所有的電子零組件都需要用到IC晶片,造成對半導體的強勁需求,且這些產品生命週期普遍很短,反應時間要快,所以也帶動Fabless公司的設立。而影響Fabless公司成長的主要兩個因素,1. 穩定的產能、技術、交貨期間。2. Fabless智財權的保護。
    台積電公司成立的策略是選擇成為一個晶圓製造專業化的公司,而不是傳統的IDM公司,在當時成立的歷史背景,我們歸納四個因素,1. 1979年Mead提出IC設計及製造可以分工,且驗證可行。2. 解決1980年代廠商對於晶圓製造產能的需求。3. 對於Fabless公司選擇產能外包時,選擇專業化晶圓代工比選擇IDM公司更不擔心自己的技術被剽竊或日後有IP爭議。4. 台灣製造技術人才相對優勢。台積電成立除了上述四點策略考量外,同樣也降低Fabless公司需要大量資金用於建造廠房、生產設備及R&D費用,且因為台積電代工規模大,也可以提供有競爭力的晶圓成本。
    所以台積電設立以晶圓製造專業化的公司出現,在當時的時空背景下,作為了半導體產業由垂直整合走向垂直分工的催化劑。



    關鍵字:晶圓製造專業化、台積電、垂直分工
    ;Abstract
    These decades, the semiconductor industry has a great impact to us. Since the 1987 TSMC fabs foundry established, Industrial structure from vertical integration to vertical disintegration. Thus, TSMC has great relation in semiconductor industry’s changing history.
    Looking back to 1980s, IBM made their first personal computer debut in 1981, leading the system from close end to open source. This changing not only boosted the development of computer accessories, but also increased the demand of consumer electronics. All these electric gadgets require IC, making the needs of semiconductor incremental strong. In the meantime, IC products’ characteristic of short life cycles as well as squashed time frames, made fabless manufacturers pop up.
    There were two main factors influence the success of fabless companies, they are: 1.) steady capacity, technology, and delivery response time; and 2.) the protection to intellectual property of fabless companies. However, TSMC choose to become a dedicated IC foundry but not a traditional IDM one. We conclude four reasons from this decision. First, Mead proposed the design and manufacture of IC can be split and proved to be effective in 1979. Second, foundries responded to the emerging demands of fabless. Third, for fabless companies, there were fewer chances to have issues on technology and intellectual property by choosing a dedicated IC foundry as their outsourcing partner. Fourth, technology specialists were comparative better in Taiwan. Without the great amount of expense on plants, production equipment, and R&D, TSMC also benefited from the scale of economic and made it cost competitive.
    This thesis is a case study to show how TSMC, a dedicated IC foundry, acting as catalyst and leading this industry from vertical integration to vertical disintegration.

    Keywords: Wafer manufacture , TSMC, vertical disintegration
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