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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/68270

    Title: 以低溫電漿輔助化學氣相沉積TEOS SiO2薄膜之 應力特性研究;Investigation of the low stress TEOS SiO2 films by low temperature PECVD processing
    Authors: 黃郁庭;Huang,Yu-Ting
    Contributors: 光電科學與工程學系
    Keywords: 矽酸四乙酯(TEOS);電漿輔助化學氣相沉積製程;Tetraethyl orthosilicate (TEOS), PECVD processes
    Date: 2015-07-13
    Issue Date: 2015-09-23 11:14:09 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 以矽酸四乙酯(TEOS)材料在低溫的電漿輔助化學氣相沉積法成長出具
    量、TEOS 流量、高低射頻的功率及沉積溫度等進行調整並且分析製鍍薄膜
    度的薄膜會造成低的薄膜應力。我們發現TEOS SiO2薄膜的應力與薄膜密度
    及沉積速率有很大的相關性,在調整鍍膜壓力、氧氣流量、TEOS 流量...
    等參數下,會使SiO2 薄膜沉積速率、應力及密度有較明顯的變化。
    TEOS 與O2當量比在8.1%、鍍膜溫度在200oC 的條件下,所備製出的TEOS SiO2
    ,其蝕刻速率約在1100±55Å/sec。且控制應力值約為300±20Mpa 的壓應力薄
    膜。;Tetra-ethyl-ortho-silicate (TEOS) SiO2 thin films were deposited
    using low temperature Plasma-enhanced chemical vapor deposition
    (PECVD) to achieve the performances of low stress and high density.
    Several process parameters including working pressure, O2 flow rate,
    TEOS flow rate, high and low frequency power rates, and working
    temperatures were adjusted to analyze the quality of the films.
    The results show when the deposition rate is high, the density
    of the film is low. And the lower density of the film will affect
    the lower stress. We found out the stress of TEOS SiO2 film has strong
    correlation by the high film density and slow deposit rates. The
    working pressure, O2 flow and TEOS flow rate can play important roles
    for the stress and density of the TEOS SiO2 films.
    Finally, we found out the high film density and low stress conditions
    keep the deposition pressure at 4torr, TEOS / O2 ratio at 8.1%
    and working temperature at 200 degrees. The deposition rate was about
    41±2.0Å/sec. the etching rate was about 1100±55Å/sec.The stress of
    the SiO2 film was compressive and the stress value range was at
    Appears in Collections:[光電科學研究所] 博碩士論文

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