微型化被動對準式4通道 x 2.5 Gbps光學連結模組之接收端研究;Research of Receiving Part for Compact and Passive-Alignment 4-channel x 2.5 Gbps Optical Interconnect Module

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/7086

Title:	微型化被動對準式4通道 x 2.5 Gbps光學連結模組之接收端研究;Research of Receiving Part for Compact and Passive-Alignment 4-channel x 2.5 Gbps Optical Interconnect Module
Authors:	陳秀萍;Hsiu-Ping Chen
Contributors:	光電科學研究所
Keywords:	45 度反射面;接收端模組;光學連結模組;45 degree reflected mirror;receiving module;Optical Interconnect Module
Date:	2009-07-02
Issue Date:	2009-09-22 10:37:00 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	近年來隨著網路通訊能力的日益進展，電腦的運算速度及系統的整合程度也日益提昇，而使傳統利用銅線傳遞電訊號的頻寬將不敷使用。於是，我們利用光連結技術來作為高速傳遞媒介，並將此技術大幅取代消費性電子產品中之各種訊號的連結。使用矽基材所製作之光連結模組將享有可微型化、散熱佳等優勢，且可套用標準半導體製程技術，來達到模組的高精度特性。在本論文中，我們所提出之微型化被動對準式光連結接收端模組，是利用一組含有45度反射斜面與V型凹槽陣列之矽基微光學平台，結合上4通道 ? 2.5 GHz的高頻傳輸線以及光檢測器元件之矽基光學模組，它是適合發展於板對板光學連接（Board-to-board Optical Interconnect）或晶片對晶片（Chip-to-chip）光學連接用途之矽基光學連接模組。在架構上，這個矽基微型化被動對準式光連結接收端模組包含有幾個重要的製程技術，如: 矽基微光學平台製程技術、高頻傳輸線製程技術、錫金焊料墊高製程技術以及模組整合封裝製程技術。微型化被動對準式光連結接收端模組已達成2.5 Gbps / channel的傳輸速度，尺寸在5 ´ 5 mm2之下。在經由光學追跡模擬的結果顯示，其接收端的響應度為-2 dB，而鄰近通道之串音雜訊在-49 dB之下。With the computing speed of computers up to several GHz and above, the telecommunications bandwidth through the traditional copper wire will be inadequate. Thus, incorporating optical light as a transmitting media will substantially improve most current interconnect technology due to its high transmission speed. Silicon optical bench technology for optical interconnect applications provides specific characteristics of miniaturized sizes, a good heat spreading, and so on. In addition, the fabrication process can be achieved by employing a standard semiconductor process technology. Therefore, it provides assembly with highly precise alignment, and mass-production possibilities. In this thesis, the compact and passive-alignment 4-channel ? 2.5 Gbps optical interconnect receiving module includes a silicon-based 45-degree micro-reflector, V-groove arrays, high-frequency transmission lines of 4-channel ? 2.5 GHz, and bonding pads with Au-Sn eutectic solder. It’s a free-space optical interconnect technology serving as a board to board or chip-to-chip interconnect, which is realized by assembling active and passive optical devices on a silicon optical bench（SiOB）. The compact and passive-alignment optical interconnect receiving module includes some important fabrication technology, ex: fabrication of SiOB、fabrication of high frequency transmission line、fabrication of bonding pads and fabrication of module assembly. The transmission speed 2.5 Gbps / channel is achieved by the compact and passive-alignment optical interconnect receiving module and the size of SiOB can be only 5´5 mm2 for 4-channel interconnect. The optical performance simulated by the ray-tracing method, the coupling efficiency between multimode fiber and photo detector can reaches up to -2 dB. The cross-talk between neighboring channels can be suppressed down to -49 dB.
Appears in Collections:	[Graduate Institute of Optics and Photonics] Electronic Thesis & Dissertation

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