| 摘要: | 本研究以即時影像導引微電鍍法來製作銅錫合金及Cu6Sn5三維微結構物。使用白金線作為陽極其線徑125 μm，以銅導線作為陰極其線徑為0.643 mm，陰陽兩極間距為80 μm，在含硫酸銅、硫酸亞錫、檸檬酸鈉與抗壞血酸之鍍液中進行電鍍，期望製作出含銅、錫兩金屬元素之微柱與微螺旋。研究目標，探討施以不同偏壓和在鍍液中添加不同濃度硫酸亞錫對微柱析鍍物表面形貌、化學組成、晶體結構以及還原電位之影響，進而尋找最佳之含銅、錫二元金屬微柱之電鍍條件，再以此條件出發，探討製作微型螺旋之可行性，並研究微螺旋析鍍角度與製程參數對微型螺旋尺寸與線徑均勻度之影響。
結果顯示:當析鍍偏壓越高、鍍液中硫酸亞錫濃度越高微柱錫含量也越高，當兩極間之偏壓設定在3.00 V、硫酸亞錫濃度控制為0.035 M，電鍍所得之含銅、錫二元金屬微柱，經分析其化學組成為含銅、錫(Cu: 88.2 ± 0.6 at. % 與Sn: 11.8± 0.6 at. %) 二元金屬之微柱，晶體結構分析顯示含Cu6Sn5相、Sn相二相，且根據Scherrer equation計算析鍍偏壓越大晶粒尺寸也隨之減少。以奈米壓痕儀測量其機械性質，其硬度為8.10 ± 0.40 GPa，楊氏模數為127.83 ± 5.20 GPa；以電化學分析量測其抗蝕性能，其腐蝕電流(Icorr)為0.27×10-2 mA/cm2，線性極化阻抗(RLP)為1435 ohm。
微螺旋析鍍結果顯示，析鍍角度30 °、製程參數4為銅錫合金及Cu6Sn5微螺旋之最佳析鍍參數，微螺旋線徑最為均勻，其d2/d1線徑比值為112 %，d3/d1線徑比值為129 %。
;In this study, three-dimensional microstructures of copper-tin alloys and its intermetallic compounds were prepared by instant image guided micro-plating.
The electroplating system uses a platinum wire with a wire diameter of 125 μm as an anode, and a copper wire with a diameter of 0.643 mm as a cathode and Cathode and anode distance is 80 μm, which is electroplated in an electroplating bath containing copper sulfate, stannous sulfate, sodium citrate and ascorbic acid
to manufacture three dimensional micro-structure with two metal elements of copper and tin. The goal of this research is to firstly investigate the effect of applying different bias and adding different concentrations of stannous sulfate on the surface morphology, chemical composition, crystal structure and reduction potential of the micro-column in the plating bath, and then seek to find the best electroplating conditions of electroplating micro-columns with two metal elements of copper and tin. Then using these conditions to research the feasibility of making micro-helix, and studying the influence of micro-helix electroplating angle and process parameters on micro-helix size and the variation of wire diameter.
The results showed that When the plating bias is higher and the higher the concentration of stannous sulfate in the electroplating bath, the higher the micro-column tin content. When the bias is set at 3.00 V and the concentration of stannous sulfate is 0.035 M, the copper and tin binary metal micro-column obtained by electroplating have the best surface morphology. After analyzing, its chemical composition is Cu: 88.2 ± 0.6 at.% and Sn: 11.8±0.6 at.%. The crystal structure analysis shows that the crystal structure is Cu6Sn5, Sn coexisting. According to the Scherrer equation, the larger the plating bias, the smaller the grain size.The mechanical properties of the micro-column were measured by a nanoindenter. The hardness was estimated to be 8.10 ± 0.40 GPa and the Young′s modulus was 127.83 ± 5.20 Gpa. The corrosion resistance was measured by electrochemical measurement. The corrosion current (Icorr) was 0.27×10-2 mA/cm2, linear polarization resistance (RLP) is 1435 ohm.
The results of electroplating micro-helix showed that electrochemical deposition angle 30 ° and process parameter 4 is the best electroplating parameter of copper-tin intermetallic compound helix because the diameter of helix wire d1、d2、d3 are the most close, the d2 / d1 ratio is 112 %, the d3 / d1 ratio is 129 %. |
