| 摘要: | 『小尺寸製程』技術開發為國內半導體產業目前發展先進製程的主流。如何突破摩 爾定律的限制和物理極限所衍生的問題是半導體產業鏈成員共同努力的目標。現行 先進製程所需的濕式化學品，其配方大多掌握在國外廠商手中；例如：台積電目前 之乾蝕刻清洗液大多從德國的巴斯夫購買，氧化矽蝕刻液則從日本的關東化學購買 。濕式化學品是含有多重成份之化學配方溶液，透過配方的最佳化，僅需一次的化學蝕刻清洗程序中，配方溶液即可達到多重的性能指標。雖然本土化學廠商可以製造濕式化學品的主要成分，但因其研發能量不足，無法提供有效的配方，所以其化學產品的附加價值不高。本計畫旨在透過產學合作方式開發『小尺寸製程』所需之濕式蝕刻液配方及應用於乾式蝕刻後之清洗液配方。這些配方都是水溶液，但為具備與氧化物反應並溶解氧化物的能力，通常會加入微量氫氟酸或其他含氟化合物。此外，為了達到良好 的蝕刻選擇比及溶液潤濕性，配方中會再添加各種抗腐蝕抑制劑如苯並三唑 (Benzotriazole)及界面活性劑如辛胺(Octylamine)等。目前我們專注在3D-NAND之蝕刻配方研究，以應未來結構層數增加時所面臨的考驗。本計畫之合作企業-僑力化工為全球半導體氫氟酸供應商，其產品之品質已獲許多半導體廠（包含台積電）認可。本實驗室專精於膠體與界面科學，對於表面現象、潤濕性質、與界面活性劑具有豐富的研究經驗；過去曾與巴斯夫、先進科材、英特格等公司產學合作研究蝕刻液與清洗液的配方。本計劃擬與合作廠商共同開發以含氟化合物為基質的配方，協助本土之化學廠商朝向產品高值化發展。 ;The development of small-scale manufacturing process has been the mainstream of semiconductor industry. As Moore's Law approaches a hard limit, the supply chain members make every effort to find possible solutions to overcome the physical constraint. Regarding wet chemicals required for advanced manufacturing processes such as etching and cleaning, unfortunately, current suppliers in our semiconductor industry are essentially foreign companies. Take tsmc as an example. Most of their cleaning agents used after the dry etching process are purchased from German chemical company, BASF, while their buffered oxide etches come from Japanese company, Kanto-PCC. Wet chemical is a multicomponent solution. Through composition optimization, its multiple performance indices can be achieved just in one-step etching process. Local chemical manufacturers are capable of supplying the main raw materials of wet chemical with high purity. Their product's additional value is not high. Because their research capability is insufficient, they fail to develop effective formula of high-valued wet chemicals for semiconductor manufacturers.This project aims to develop wet etchants used in advanced wet etching processes and cleaning agents used after advanced dry etching processes. Both of those agents are aqueous-based solutions. In order to etch targeted material or remove related residues on the substrates, a trace of hydrofluoric acid (HF) or other fluorochemical compounds has to be added into the solution. In addition, to obtain a good etch selectivity and improve the surface wettability, the corrosion inhibitors such as Benzotriazole and surfactants such as Octylamine have been included in the composition of wet etchants and cleaning agents. Sunlit Company, the cooperation partner in this project, is the global HF supplier. Their products have gained acceptance in many semiconductor companies including tsmc. On the other hand, our labortaroy is specialized in colloid and interface science and has abundant experiences in studying wetting properties as well as surfactants. Now, we focus on the formula for 3D-NAND fabrication because the increasing of layer number in the structure will lead to some challenges which we try to solve.Furthermore, we had cooperated with wet chemical suppliers for semiconductor manufacturers, including BASF, ATMI, and Entegris, to develop the formula of wet etchant and cleaing solution. In this project, we will collaborate with Sunlit Company to develop the fluororide-based products that will be used in the wet chemicals. The success of this project will promote significantly the values of the products of local chemical manufacturers. |
