| 摘要: | 本研究調查銅污泥處理廠之多氯聯苯戴奧辛及呋喃(Polychlorinated dibenzo-p-dioxins/furans, PCDD/Fs)、戴奧辛類多氯聯苯(dioxin-like Polychlorinated biphenyls, dl-PCBs)及多環芳香烴(Polycyclic Aromatic Hydrocarbons, PAHs)之排放濃度與物種分佈特性，藉由調整空氣污染防制設備(Air Pollution Control Devices, APCDs)操作參數，探討各物種間之去除效率。結果顯示煙囪排氣之PCDD/Fs毒性當量濃度為4.45 - 8.10 ng I-TEQ/Nm3，超過固定污染源之法規管制標準(0.5 ng I-TEQ/Nm3)，dl-PCBs及PAHs量測結果分別為0.617 - 1.60 ng WHO2005-TEQ/Nm3及89.7 - 695 ng BaPeq/Nm3；飛灰及底渣之PCDD/Fs毒性當量濃度亦超過台灣有害事業廢棄物認定標準(1.0 ng-TEQ g-1)，需妥善處理。排氣及灰份之PCDD/Fs物種毒性當量均以2,3,4,7,8PeDF及1,2,3,7,8,9HxDF為主要貢獻物種；而dl-PCBs物種毒性當量則以PeCB-126佔比最高；排氣之PAHs物種毒性當量分佈以BcFE及DBalP佔比最高，灰份之PAHs物種毒性當量分佈則以BcFE、5-MC、BaP及DBalP為主。此外，二燃室＋驟冷塔對PCDD/Fs、dl-PCBs及PAHs之去除效率分別達97%、90%及70%；相對而言，熱交換器+袋式集塵器及洗滌塔對於PCDD/Fs及dl-PCBs有不減反增之趨勢，研究結果發現吸附於熱交換器沉積物之PCDD/Fs及dl-PCBs脫附至氣相導致袋式集塵器出口濃度升高，而洗滌塔因記憶效應導致煙囪排氣之PCDD/Fs及dl-PCBs濃度升高，應審慎考量其存在之必要性。;The characteristics of PCDD/Fs, dl-PCBs and PAHs emitted from a copper-containing sludge treatment plant are investigated in this study. The removal efficiencies of PCDD/Fs, dl-PCBs and PAHs achieved with APCDs are evaluated via simultaneous sampling at inlet and outlet of APCDs. The results indicate that the TEQ concentration of PCDD/Fs at stack is 4.45 - 8.10 ng I-TEQ/Nm3, which exceeds the Dioxin Emission Standards for Stationary Pollution Sources (0.5 ng I-TEQ/Nm3). The TEQ concentration of dl-PCBs and PAHs at stack are 0.617 - 1.60 ng WHO2005-TEQ/Nm3 and 89.7 - 695 ng BaPeq/Nm3, respectively. In addition, the PCDD/Fs TEQ concentrations of fly ash and bottom ash also exceed the Standards for Defining Hazardous Industrial Waste (1.0 ng-TEQ g-1), which should be properly treated. Moreover, in both stack and ash, 2,3,4,7,8PeDF and 1,2,3,7,8,9HxDF are the main TEQ contrubution, while PeCB-126 is the donminant congener of dl-PCBs. As for PAHs, BcFE and DBalP are the highest TEQ distribution in exhaust gas, while BcFE, 5-MC, BaP and DBalP are dominant in ash. In addition, the removal efficiencies of PCDD/Fs, dl-PCBs and PAHs achieved with SCC + QT reach 97%, 90% and 70%, respectively. However, the concentration of PCDD/Fs and dl-PCBs after heat exchanger+BH and WS increase. PCDD/Fs and dl-PCBs are desorbed to the gas phase in the heat exchanger, causing the increase of concentration after heat exchanger+BH. Besides, the concentration of PCDD/Fs and dl-PCBs increase across the WS is due to the memory effect. The necessity of its existence should be carefully considered. |
