| 摘要: | 未來2020年預計佈建的第五代行動通訊網路（5G）將提供更大的資料量、更高的傳輸速率、更短的延遲，並可支援更多的通訊裝置連線，以建構萬物聯網的環境。在物聯網應用中，將會有為數眾多的無線感測器。其中，有些感測器不搭載電池，使用射頻辨識技術，以被動的形式來等待基站或使用者的讀取。在5G實體層中air interface的載波頻段規劃中，除了銜接目前4G的低於6 GHz的sub-6 GHz射頻頻段，更釋出了24–28 GHz的微波頻段及37–40 GHz與64–71 GHz毫米波頻段。在未來5G毫米波開始使用後，無線感測器也將可使用毫米波辨識（millimeter-wave identification, MMID）技術。由於毫米波頻段波長很短，因此MMID tag的天線尺寸也將變得很小，甚至可將天線製作於封裝中或晶片上，適用於實現尺寸在mm等級的微型無線感測器。本計畫「應用於微型無線感測器之天線整合毫米波辨識標籤晶片」之目的為開發一操作於upper 37-GHz band、具有on-chip天線的毫米波辨識晶片模組。預計開發之晶片模組的為一被動式的MMID標籤；其能量來源為遠端MMID讀取器所發射之功率。操作在upper 37-GHz毫米波頻段的天線及整流器與調變器電路將以GaAs pHEMT製程來實現；而經整流器轉換下來的低頻訊號則輸入到以Si CMOS實現的電路中，包括低壓差穩壓器及ASK-PPM解調器。兩晶片則將以覆晶鍵合的方式連接並堆疊起來，以達到微型化的效果。本研究計畫預計以一年的時間來完成。前期的重點在於電路設計；中期的重點為量測設置的準備；後期的重點則是晶片與模組的量測。本計畫之成果預計將以一微型upper 37-GHz band毫米波辨識標籤晶片模組來呈現。 ;The 5th generation (5G) mobile network to be deployed in 2020 will feature a larger amount of data, faster data rate, shorter latency, and is able to support a larger number of connections with lots of mobile devices at the same time, constructing an internet of things (IoT). In IoT applications, there will be numerous wireless sensors. Among them, some sensors are battery-free and use RFID technology, waiting to be read by base stations or users in a passive manner.In the planning of the carrier frequency bands for the air interface in the 5G physical layer, in addition to the sub-6 GHz RF bands that is ready to be added into the current 4G bands, microwave and millimeter-wave bands, such as 24–28 GHz, 37–40 GHz, and 64–71 GHz, are also opened up. After the 5G millimeter-wave becomes a reality in the near future, wireless sensors will be able to adopt millimeter-wave identification (MMID) technology. Since the wavelength is short for millimeter waves, the size of the antennas for the MMID tags would be very small. The antennas can be realized in package or on chip, thereby good for miniature wireless sensors with size on the order of mm.The proposed project "Antenna-Integrated Millimeter-Wave Identification Tag Chips for Miniature Wireless Sensors" is aimed at developing an MMID chip module that has an on-chip antenna operating in upper 37-GHz band. The chip module to be developed is a passive MMID tag, using the transmit power of a remote MMID reader as its energy source. The antenna and the rectifier/modulator circuits operating at the upper 37-GHz millimeter-wave band will be implemented using a GaAs pHEMT process, whereas the low-frequency signal converted by the rectifier will be processed by circuits realized using a Si CMOS process, including low-dropout regulator and ASK-PPM demodulator. The two chips will be stacked and connected together by flip-chip bonding so that the module is miniaturized.We plan to complete this project in one year of time. The focus for the early stage will be circuit design. In the middle term of the project period, we need to prepare the measurement setup. When the time is near the end, we will measure and test the chips and the module. A miniature upper 37-GHz-band MMID tag chip module will be presented when the project is completed to summarize the research and development efforts. |
