目前傳統微米元件製作流程，須經由晶圓磊晶(EpiWafer)後經過檢測、切割為小晶粒(Die)進行分類，再逐顆封裝為S.M.D.置入於捲帶內，在藉由真空吸頭逐一取放(Pick&Place)於印刷電路板上的設定位置，排列組成所須之陣列。此一過程繁雜耗時，其中逐一取放動作更是大大影響製程所需時間，而接觸式的轉移技術會因為壓合之動作，可能造成微米元件損毀產生不必要的碎屑，影響後續製程的穩定度，為解決微米元件轉移製程上的問題，本論文使用非接觸式轉置技術，自行設計一套微米元件非接觸式光轉置轉移機台，以突破傳統真空取放式轉置技術的種種限制並縮短微米元件製程步驟。其中需對掃描振鏡、影像辨識、雷射控制、移動平台和膠黏材料等多項不同領域技術進行整合，以提高微米元件轉移時的穩定度和轉移範圍，並將微米元件精準轉移至目標基板上。 本論文之機構為自行設計研發，由相關設備廠商進行組裝及校正，裝上光學掃描系統，搭配適合的膠材進行翻貼和轉移，並設計一套微米元件轉移製程方法，進行實際轉移與驗證，最後對微米元件進行功能測試以確保其製程不會對微米元件造成損害。 ;Nowadays, the traditional production processes of micro-components must go through epitaxy and then be inspected, cut into small dies for classification, and then packaged as SMD and placed in tape. By using vacuum suction head to pick and place micro-components on the setting area of PCB to form the array. The processes of manufacturing micro-components are complex and time-consuming. Especially the Pick & Place process, which occupied a huge amount of time will slow down the process. Also, contact type transfer technique may cause damage to the device and generate unnecessary debris, which will affect the stability in the latter process. To solve the problem, our research introduces a non-contact transfer technique to design a set of transfer equipment by ourselves, which can break through the limitations of traditional vacuum pick-and-place transfer technique. And shorten the process steps of manufacturing micro-components. We integrate techniques in different fields, including Galvo scanner, Image processing, Laser beam machining, Gantry platform and Adhesive backers, which optimized the stability and transfer domain on target substrate. This thesis focuses on the transfer machine design and control system construction with an optical scanning system, matched with suitable adhesive materials for flipping and transfer, and a set of micro-component transfer process methods are designed for actual transfer and verification. And finally perform functional tests on micro-components to ensure that the transferring process will not cause damage to the micro-components.
