硬脆材料加工為當今一大重要研究課題之一，目前在面板、半導體以及各式精微加工皆面臨諸多難題。在傳統加工多使用機械式鑽削進行加工，但由於使用材料為硬脆材料，在加工時容易產生脆性破裂問題。 本論文使用複合加工方式，先使用雷射改質，將待鑽孔位置進行局部軟化，接著使用影像定位技術，將高速主軸對準雷射改質區域，再以高速雕銑機進行二次複合加工。 本篇論文使用易盟科技股份有限公司所開發之CM-650高速雕銑機進行實驗，搭配兩台CCD攝影機建立視覺系統，並使用C#進行座標轉換及影像處理之人機介面。 ;The processing of hard and brittle materials is one of the most important research topics nowadays. There are many difficulties while facing panels, semiconductors and various micro-processing currently. Drills are often used in traditional processing. Fragments is easy to occur during processing hard and brittle materials. In this thesis, a composite processing method is used. First, laser modification is used for partially softening. Then, image positioning technology is used to align to the laser-modified area, and a high-speed machine is used for secondary hybrid processing. The CM-650 high-speed machine developed by Yimeng Technology Co., Ltd. is used in this paper, two CCD cameras are used to establish a visual system, coordinate conversion and image processing human-machine interface are designed by C#.
